Bhubaneswar: India moved a step closer towards ending its dependence on imported chip packaging technology on Sunday, as Odisha Chief Minister Mohan Majhi laid the foundation stone for the country’s first advanced glass substrate-based chip packaging unit in Bhubaneswar, which promises to provide cutting-edge onshore semiconductor packaging capability to critical sectors ranging from artificial intelligence to defence.
The facility, built by 3D Glass Solutions Inc. (3DGS), based in the US at Info Valley in Bhubaneswar, entails an investment of approx $1,943 crore and will deploy advanced 3D Heterogeneous (3DHI) packaging technology for which India has so far relied on imports.
Union Minister for Electronics and IT Ashwini Vaishnao, who attended the foundation stone laying ceremony along with state IT Minister Mukesh Mahaling, described it as a “historic day” for Odisha. “The state is diversifying from minerals into several new industrial bases,” Vaishnau said, noting the emergence of Odisha as an IT hub and electronics manufacturing destination.
“The coming of the high-tech industry to Odisha is a matter of pride. This is advanced technology. Normally, silicon substrate is used in manufacturing chips, and now advanced 3D glass substrate technology will be used. The foundation stone has been laid for the first major factory using this technology in Odisha. We will also double the factory capacity after completing the first phase of the factory,” Vaishnau said.
The vertically integrated unit will package semiconductor chips for high-risk applications including artificial intelligence, 5G, defense systems, data centers and high-performance computing. On a large scale, the facility is designed to produce 69,600 glass substrates, 50 million aggregate units, and 13,200 3DHI units per year. It is expected to generate more than 2,500 direct and indirect job opportunities.
The technology stack centered on glass intermediates and embedded glass substrates represents a major leap from traditional organic packaging, providing better thermal performance and higher integration density critical for AI-class chips.
The 3DGS plant is the second semiconductor facility to be started in Odisha within months. SiCSem Private Limited, in collaboration with Clas-SiC Wafer Fab Ltd. The UK-based company has built India’s first commercial silicon carbide (SiC) manufacturing unit at the same Info Valley campus targeting an annual production of 60,000 wafers and 96 million packaged units for electric vehicles, railways, defence, and renewable energy.
The Union Cabinet had approved the two Odisha projects in 2025 as part of a broader drive that gave the green light to 10 semiconductor projects nationwide, with cumulative investments of over $1.6 million crores.
The 3DGS and SiCSem approvals are part of India’s larger ambition to build a self-reliant semiconductor ecosystem that reduces dependence on chip imports.
